| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_37b416a8c0d2b0f1c3d6026d932027af |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-031 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate |
2004-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93d8f66c6d341ee05de85be1fbc12c09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c52733b42e97a07938793cc1dfd47fa3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_095dcf07caf107c403dc6387af0b3f21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04daa3660db1d37b3b36a32120f31677 |
| publicationDate |
2005-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005233543-A1 |
| titleOfInvention |
Method of fabricating microelectromechanical system structures |
| abstract |
A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021231217-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102431990-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11193208-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220001517-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008029863-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7402905-B2 |
| priorityDate |
2004-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |