| abstract |
A method for fabricating an electronic component, such as a semiconductor device, carrier, or other semiconductor device component, includes providing a support around at least a portion of a contact of the electronic component. The support is configured to receive at least a portion of a conductive structure that is to be secured to the contact. The support may also be configured to define a shape of at least a portion of the conductive structure. The support may be preformed, then placed on the electronic component, or formed on the electronic component. A programmed material consolidation process may be used to form the support. |