| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-05 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E03B3-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D18-00 |
| filingDate |
2005-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56001f6a1048383fd633d33d2ecd3cc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c5d56c6c033d9fd7b104c7056105aba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ade66176638e2666d0c7999a39f1b24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a50587834fb2591d295e576d00a4e224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_154218381b96f86f27c42b1cdfd446fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3eeefe82d28ab4a4367f538655ee2d52 |
| publicationDate |
2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005222336-A1 |
| titleOfInvention |
Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process |
| abstract |
A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (A) a styrene polymer and (B) a diene polymer. A method for producing the above chemical mechanical polishing pad, the method comprising the steps of preparing a composition comprising (A) a styrene polymer, (B) a diene polymer and (C) a crosslinking agent, shaping the above composition into a predetermined shape, and heating the composition during or after shaping to cure it. A chemical mechanical polishing process which comprises polishing a surface to be polished of an object to be polished by use of the chemical mechanical polishing pad. According to the present invention, it is possible to provide a chemical mechanical polishing pad which can be suitably applied to polishing of metal film and insulation film, particularly to an STI technique, provides a flat polished surface, can provide a high polishing rate and has a satisfactory useful life. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009191795-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8388799-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012309270-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8939818-B2 |
| priorityDate |
2004-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |