| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10719
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10348
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-325 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2004-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de00994976ee093b737722ba6bbc65a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9416a6059e28b1915283bb91bde30fdd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97b653be3a64b12847bcbbcb55a0ade6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38b4152cd502e77850793cd567022ba9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6453168d5f73ddabdb4ef906218744d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_226b02e1f75934f5c594d484029ff48c |
| publicationDate |
2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005221635-A1 |
| titleOfInvention |
Micro-bumps to enhance lga interconnections |
| abstract |
An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuzz button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008258297-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9726691-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015192633-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9049789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007074351-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7566648-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10371717-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11193953-B2 |
| priorityDate |
2004-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |