http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005221620-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dd467702ade456525b7168b3e349ae53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_480a91c83daca46b1bfb4f2b869d53c2 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30608 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate | 2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2cc0ee1ebe19afe5bb0a99ec24615f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23a65f40545b98bf01a896841eb8455a |
| publicationDate | 2005-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2005221620-A1 |
| titleOfInvention | Process for etching a substrate |
| abstract | The invention relates to a process for etching at least one substrate, in particular at least one silicon wafer for the fabrication of DRAM memory chips. The process comprising at least one substrate, for a first etching step, is arranged for a predetermined time in a first vessel containing a first etchant, then at least one substrate, for a first rinsing step, is arranged for a predetermined time in a second vessel containing a first rinsing agent, the first rinsing agent containing at least one wetting agent, and then at least one substrate, for a second etching step, is arranged for a predetermined time in a third vessel containing a second etchant. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012252212-A1 |
| priorityDate | 2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.