http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005214460-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-18
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
filingDate 2003-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2ec9206df5aa20b2560b84227aa33a3
publicationDate 2005-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005214460-A1
titleOfInvention Method of depositing copper on a support
abstract The invention relates to a process for the deposition of copper on a support. The process consists in bringing a copper precursor, in the vapor phase, into contact with the heated support, optionally in the presence of hydrogen. The copper precursor is in the form of a CuCl or CuBr composition in a nonaromatic, nonplanar and heteroatom-free liquid organic solvent which exhibits at least two nonconjugated unsaturations.
priorityDate 2002-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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