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filingDate 2005-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005195247-A1
titleOfInvention Wire bonding method and liquid-jet head
abstract A wire bonding method for connecting a bonding wire comprised of gold to a bonding pad comprises pressing the bonding wire against the bonding pad under a load of 78.4×10 −3 N or less, while heating the bonding wire at a temperature of 100° C. or lower, and applying ultrasonic waves having a frequency of 100 to 120 KHz and an amplitude of 0.5 to 6 μm, thereby connecting the bonding wire to the bonding pad.
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