| abstract |
A method for mounting semiconductor chips includes the steps of: a) providing a semiconductor chip having a surface that has a diaphragm region and a peripheral region, the peripheral region having a mounting region; b) providing a substrate which has a surface having a recess; c) mounting the mounting region of the semiconductor chip using a flip-chip technique onto the surface of the substrate in such a way that an edge of the recess lies between the mounting region and the diaphragm region; and d) underfilling the mounting region using an underfilling component, the edge of the recess being used a demarcation region for the underfilling component, so that no underfilling component is able to get into the diaphragm region. Also provided is a corresponding semiconductor chip system. |