| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3c33039e3a8a5dbf9e4065e221ac7eb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C25-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 |
| filingDate |
2005-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad3f9e9285d63f3d49720dc1c045851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f38727f604bc1e625ea811155e8341a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_896157a36f48e1ca06ceede1c5cc784c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c43efaf5065f2de599822dcc5b57d0c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3826806ab680dd14f7314215e1177fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c095d72ebd11a919b476103f3ba6e1b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3458003601e0346bdcc6fe346060d705
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91ebdd521ab691a7c96187dee046cf0d |
| publicationDate |
2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005194258-A1 |
| titleOfInvention |
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
| abstract |
Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007075265-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007259641-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7791290-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7791053-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7791291-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007085039-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7282776-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007200784-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7710040-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115313012-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7876793-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7714513-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11466358-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7718977-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7723698-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7646991-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7728702-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7728397-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7986113-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7732786-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7655934-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007021358-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7741934-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7656094-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7990336-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7659513-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8188431-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7746532-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007170370-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007256472-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006035173-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7758739-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8384042-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7679067-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007257739-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7253426-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7688274-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007258689-A1 |
| priorityDate |
2003-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |