patent/US-2005185880-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005185880-A1

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-12002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-12004
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filingDate	2005-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d
publicationDate	2005-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2005185880-A1
titleOfInvention	Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication
abstract	The present invention provides a device for optical communication comprising: a substrate for mounting an IC chip having a light emitting element and a light receiving element mounted at predetermined positions; and a multilayered printed circuit board having an optical waveguide formed at a predetermined position, which is low in connection loss among the mounted optical components and which has excellent connection reliability. The device for optical communication according to the present invention comprises the substrate for mounting an IC chip and the multilayered printed circuit board, wherein the substrate for mounting an IC chip includes conductor circuits, interlaminar insulating layers and via-holes for connecting the conductor circuits, with the interlaminar insulating layers interposed therebetween, to each other, and a light receiving element and a light emitting element are mounted on the substrate for mounting an IC chip.
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