| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0156 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 |
| filingDate |
2004-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0521ebd2a243228d8fcf3f3a101d9871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67e8d2a8be13e24658d94f352e9c8c47 |
| publicationDate |
2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005158502-A1 |
| titleOfInvention |
Release process film |
| abstract |
A release process film which comprises a base material film and an adhesive layer disposed on one face of the base material film and is used by attaching to a flexible printed circuit board, wherein the adhesive layer is formed with an adhesive comprising an acrylate-based copolymer at least comprising 40 to 99% by mass of a butyl acrylate unit and 1 to 20% by mass of a monomer unit having a crosslinking functional group and a crosslinking agent and the film has specific properties. The film can effectively suppress contamination of the surface of a printed circuit board with solvents and foreign substances and formation of flaws on the surface in the process using the flexible printed circuit board for producing electronic and electric instruments. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8278142-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009291524-A1 |
| priorityDate |
2004-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |