Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5cf374ecaed27c8b9bd75d56acd7e801 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C40B40-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C40B40-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J2219-00653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J2219-00659 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J2219-00725 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J2219-00722 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-5438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-40 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C40B40-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C40B40-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N33-53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N33-543 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N37-00 |
filingDate |
2004-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ca79f38b633d8042379f827742165e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b502e1c6bea16d7a1e650e085086e9f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a20d89b6f9c21ae4532939d1f85636be http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddaabea3c73f02657c8c8f431ff5e194 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc40103f711102f4736ec3bfe6c00f6b |
publicationDate |
2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2005158451-A1 |
titleOfInvention |
Permeation layer attachment chemistry and method |
abstract |
Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface. Methods for covalently attaching the permeation layer to the microchips are also described. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10770670-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011095756-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017040558-A1 |
priorityDate |
1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |