Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
filingDate |
2004-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf6c1aaa63807070ef7bcb4f918c5128 |
publicationDate |
2005-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2005153545-A1 |
titleOfInvention |
Methods of forming copper interconnections using electrochemical plating processes |
abstract |
Methods of forming a copper interconnect using an ECP process is disclosed. One disclosed method includes forming a barrier metal layer on the surface of a single or dual damascene structure; forming a silver layer as a seed layer on the surface of the barrier metal layer; forming a Cu layer on the silver layer by performing an ECP process using the silver layer as the seed layer; and performing an annealing process and a chemical mechanical polishing process for the Cu layer to form a Cu interconnect. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7452812-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103474394-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7745935-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007238294-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009102051-A1 |
priorityDate |
2003-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |