| abstract |
In a pattern formation method of this invention, a resist film is formed on a substrate and the resist film is exposed to a solution including a compound having a hydrophilic group. Thereafter, with an immersion liquid provided on the resist film having been exposed to the solution, pattern exposure is performed by selectively irradiating the resist film with exposing light, and the resist film is developed after the pattern exposure. Thus, a resist pattern made of the resist film is formed. |