| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
| filingDate |
2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b092dd3739094da6b5648c23399e8d87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05156207425a11318c64bc1b1a1480c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de05961350db3364f9f7ec9ddf4858a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57967a391ab5b900bb52a40f838afebb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8eccb66b30e8358afca3258e63554888 |
| publicationDate |
2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005126919-A1 |
| titleOfInvention |
Plating method, plating apparatus and a method of forming fine circuit wiring |
| abstract |
A copper plating film has a lower chlorine ion content. Circuit wiring of high electromigration resistance is formed by electroplating. In a method of copper plating using a leveler containing a nitrogen-containing high molecular compound, the leveler is dechlorinated prior to its use for plating. A plating apparatus has a tank for preparing a plating solution, a device for dechlorinating a leveler, a leveler supply station for supplying the dechlorinated leveler to the tank and a plating station. A method of forming fine circuit wiring includes forming a circuit with a phosphorus-doped copper plating layer on a substrate for an electronic circuit having a fine circuit pattern, a barrier layer and any necessary seed layer formed thereon. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2161355-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8262891-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009277801-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009166213-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009280243-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8500985-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110740579-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8236160-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010219081-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010224501-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8679317-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8506788-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7947163-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7482691-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006070885-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2161355-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007084732-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008029891-A1 |
| priorityDate |
2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |