Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-1871 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-3103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-123 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-3173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-3169 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-105 |
filingDate |
2003-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44cf626c84d7dbd55d8c22e6f6d5f1db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e89d3a4e8f2425bf0083aac7f4364dc9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d14e7cb9cc8aee627dfcbee853795550 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2cab866119d4961c33eb7078b20f143 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c44a483409afff57c9130a9fb06b100 |
publicationDate |
2005-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2005126706-A1 |
titleOfInvention |
Non-corrosive low temperature liquid resist adhesive |
abstract |
Methods of improving the adhesive characteristics of an adhesive resin composition and the use of the adhesive for bonding substrate materials, such as ceramic materials and manufacturing tools, are described. The adhesive composition includes a resist adhesive resin and a solvent having a boiling point in the range of about 30° C. to about 80° C. The methods and the adhesive composition find utility in hard disk drive applications, such as in the manufacture of sliders for hard disk drives. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7196872-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005243469-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7851138-B2 |
priorityDate |
2003-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |