http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005095846-A1

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2004-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed52792ee6ebea0048b938a02239e348
publicationDate 2005-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005095846-A1
titleOfInvention System and method for defect free conductor deposition on substrates
abstract A system and method for depositing a defect-free conductor on semiconductor substrates having features and seed layers with defective regions. A repair layer is deposited over the seed layer and the defective regions in a deposition module within a housing. The repair layer can be deposited by atomic layer deposition or chemical vapor deposition. A conductive material is then electroplated over the seed layer to fill the features and form a defect-free conductive layer over the top surface of the substrate. The electroplating is performed in another deposition module within the housing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8182608-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010010642-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009078204-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009321933-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2139034-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10741799-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009042146-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9653352-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7964497-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7869961-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4536809-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015294906-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008077373-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008086291-A1
priorityDate 2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.