| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76886 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2003-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c71b95154bc889bacc23720bfa83f980
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cd8a217f80be1fe6cfca27b596d7b27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_529266fd97aa17f348bacf4d9b63618d |
| publicationDate |
2005-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005095843-A1 |
| titleOfInvention |
Method for improving reliability of copper interconnects |
| abstract |
Doping copper interconnects ( 100 ) with silicon ( 115 ) has been shown to improve Electromigration and Via Stress Migration reliability. After copper ( 118 ) is deposited by electrochemical deposition and chemically-mechanically polished back, doping is achieved by flowing SiH 4 over the copper interconnect ( 100 ) for 0.5 to 5 seconds at a temperature of 325-425° C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009117735-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009170305-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7737013-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102006056624-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102006056624-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008122111-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7413985-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009061714-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008132064-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009061714-A2 |
| priorityDate |
2003-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |