| abstract |
An adhesive sheet for producing a semiconductor device, which comprises a base layer and an adhesive layer and is used in the process for producing the semiconductor device comprising the step of sealing a semiconductor element connected to an electric conductor with a sealing resin on the adhesive layer , wherein the adhesive layer of the adhesive sheet comprises a rubber component and an epoxy resin component and the ratio of the rubber component in organic materials in the adhesive layer is from 5 to 40% by weight. According to this adhesive sheet, pollution is not caused by silicon components, a sufficient elastic modulus can be kept even at high temperature, and a problem that paste remains is not easily caused. |