abstract |
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device: n n nwherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R 1 is a hydroxyl group or —O—R 3 wherein m is an integer of 0 to 2; R 2 is a hydroxyl group, a carboxyl group, —O—R 3 or —COO—R 3 wherein n is an integer of 0 to 4; R 3 is an organic group having 1 to 15 carbon atoms; n n nwherein, each of R 4 and R 5 is a divalent organic group; each of R 6 and R 7 is a monovalent organic group; n is an integer of 0 to 20. |