| abstract |
Selectively consolidated conductive elements. The conductive elements may include multiple, mutually adhered regions that comprise conductive material, such as a thermoplastic conductive elastomer or a metal. In semiconductor device assemblies, the conductive elements may electrically connect contacts of semiconductor device components to one another. The conductive elements may alternatively comprise conductive traces or vias of circuit boards or interposers. Selective consolidation processes may be employed to fabricate the conductive elements. Such processes may include use of a machine vision system with at least one camera operably associated with a computer controlling consolidation or application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the conductive element is to be fabricated. |