| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e6eeb4c74ad48df7a024eb782b36a26 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-02 |
| filingDate |
2004-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69af4594b3ea4e49d6648823d9543cf4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1fa0b2d98b13c3cdd9bbdd38c9f59ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38d8182d36da53e5e87e99a5c5101fce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_509601537751f3bc778f96d89407e07c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aca849fa92bd6a4556f6628f14f2576f |
| publicationDate |
2005-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2005004270-A1 |
| titleOfInvention |
Curable epoxy resin composition, fabrication process using the same and shaped articles obtained therefrom |
| abstract |
Curable epoxy resin composition comprising a polyepoxide; an anhydride hardener; a 1-substituted imidazole as catalyst; at least a diol in an amount of from 5 to 50 phr of said polyepoxide; a filler in an amount of from 200 to 600 phr of said polyepoxide and optionally additives. It shows improved crack resistance properties. An improved process for the fabrication of thermoset articles is also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11292871-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012208924-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011184092-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9388274-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8372922-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010018750-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11186675-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010113649-A1 |
| priorityDate |
2003-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |