| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate |
2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a062e683c320a5f86081d322fc24bf88 |
| publicationDate |
2004-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004256055-A1 |
| titleOfInvention |
CMP pad with long user life |
| abstract |
Chemical mechanical polishing (“CMP”) systems utilize specially designed pads to precision polish ultra-flat surfaces of silicon wafers and other similar materials. This invention proposes improving the longevity and performance of CMP pads by modifying the surface properties of the pads through treatment of the surface with radiation or through the inclusion of metals or metal oxides in the surface layer of the pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107641835-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019070706-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101974689-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10722998-B2 |
| priorityDate |
2003-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |