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filingDate 2004-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cc7bf9d019b04222165e69870c39680
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publicationDate 2004-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004251543-A1
titleOfInvention Semiconductor device
abstract The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.
priorityDate 2003-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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