abstract |
Copper layers are deposited on substrates by bringing the substrate into contact with a solution of copper (II) formate and alkoxyalkylamines of formula I R 1 —O—(CH 2 ) n —CHR 2 —NH 2 , where R 1 is methyl or ethyl, R 2 is hydrogen or methyl and n is 1, 2, 3 or 4, at from 120 to 200° C. and from 0.1 to 5 bar. |