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filingDate 2004-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44ff3285e9819f83664731f9401e761c
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publicationDate 2004-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004249063-A1
titleOfInvention Deposition of copper layers on substrates
abstract Copper layers are deposited on substrates by bringing the substrate into contact with a solution of copper (II) formate and alkoxyalkylamines of formula I R 1 —O—(CH 2 ) n —CHR 2 —NH 2 , where R 1 is methyl or ethyl, R 2 is hydrogen or methyl and n is 1, 2, 3 or 4, at from 120 to 200° C. and from 0.1 to 5 bar.
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