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filingDate 2004-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be041aeea0e95d58359b39f27228da8d
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publicationDate 2004-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004245607-A1
titleOfInvention Semiconductor integrated circuit device and method of manufacturing the same
abstract A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.
priorityDate 2000-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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