| abstract |
A thermosetting, heat-resistant, silicon based powder coating composition is provided for use on substrates likely to be subjected to high temperatures above 550° C. The powder coating composition contains low melting glass particles, which soften and flow at temperatures in the range which the organic components of the coating burn away. The glass particles at such temperatures are therefore able to fill voids in the film formed from the coating powders and prevent adhesion failure of the coating from the substrate. |