| abstract |
A semiconductor package ( 101 ) has a die ( 1 ), a leadframe ( 4 ), a bond pad ( 6 ), an encapsulation ( 3 ) and a wire bond ball ( 2 ). The wire bond ball is formed on the bond pad by bonding one end of a bond wire ( 7 ), and remainder of the bond wire is removed. Locations ( 23 ) for attaching the wire bond ball are recorded with reference to fiducials ( 5 ) on the lead frame. The encapsulation covers the die, deposits and die attach flag ( 24 ) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings ( 17 ) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die. |