| abstract |
A semiconductor device comprises a first transistor 38 a having a first gate electrode 22 ; a second transistor 38 b having a second gate electrode 34 which is different from the first gate electrode; an insulation film 28 formed between the first gate electrode and the second gate electrode; and an interconnection electrode 44 buried in a concavity 42 formed in the first gate electrode, the second gate electrode and the insulation film and electrically interconnecting the first gate electrode and the second gate electrode. The interconnection electrode is buried in the concavity formed in the first gate electrode, the second gate electrode and the insulation film, and the interconnection electrodes electrically interconnects the first gate electrode and the second gate electrode, whereby the semiconductor device can have high integration and can be reliable. |