| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-814 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4908
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-458
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2003-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ac76ee34ee01daaac3f43d52798c711
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09134e2d4fc42e1bc810929f5cc4feef |
| publicationDate |
2004-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004173900-A1 |
| titleOfInvention |
[contact structure and manufacturing method thereof] |
| abstract |
A contact structure and manufacturing method thereof is provided. A substrate having a first conductive layer and a dielectric layer thereon is provided. The dielectric layer has a contact opening that exposes a portion of the first conductive layer. A conductive nano-particle layer is formed on the exposed surface of the first conductive layer. Thereafter, a second conductive layer is formed inside the contact opening to cover the conductive nanoparticle layer and form a contact structure. The conductive nanoparticle layer at the bottom of the contact prevents the second conductive layer from peeling off and costs much less to produce. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107924878-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9478518-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886250-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017194596-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007037387-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10535626-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112006000696-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8115313-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013040451-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710718-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892246-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9633971-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11282801-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017194279-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10230073-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9818713-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1748478-B1 |
| priorityDate |
2003-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |