| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0454b8157065aa79e639d913ec748f6b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
| filingDate |
2002-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71f22330889d1c4f8cf6e1aefc824caf |
| publicationDate |
2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004089946-A1 |
| titleOfInvention |
Chip size semiconductor package structure |
| abstract |
A chip size package (CSP) structure is disclosed. The CSP package structure utilizes columnar composite bump structures as contact joints to bond to contact pads. The columnar composite bump structures have high melting point bump layers on the contact pads and a low melting point bump layers. The high melting point and low melting point bump layers are formed on under bump metal (UBM) layers by composite plating processes so that both the bump layers need not to be etched and the underlying contact pads will not be damaged. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10840201-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8604625-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE46466-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010025862-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE46618-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010044084-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE48420-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113539860-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9171798-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8039956-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10269746-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013256876-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102376668-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014211438-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110164786-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007040237-A1 |
| priorityDate |
2002-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |