| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H2003-0485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H2003-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-0552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02 |
| filingDate |
2002-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f87eb017d4be34f4159d6abfc3c643db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f9f1433c1a5d13017db9925353201a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a034e6bb0fd18bde70ba866892df70d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee713e197b34476759eb875101b2ec65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_919966a435d19e23e08e5cac4a3eb832 |
| publicationDate |
2004-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004070462-A1 |
| titleOfInvention |
Oscillator package |
| abstract |
An oscillator package with an improved crystal mount. The oscillator package has substrate with a top cavity and a bottom cavity. Vias extend through the substrate between the top and bottom cavities. A semiconductor die is located in the bottom cavity and is covered by a sealant. A crystal is located in the top cavity. The crystal is mounted in the top cavity using a thermosonically deposited gold bump. The gold bump is attached between an electrode pad and a contact pad. The gold bump provides an electrical connection between the crystal and the substrate and supports the crystal. A cover and seal ring are attached to substrate to hermetically seal the top cavity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7522006-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007126519-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007163364-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101807896-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8269568-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11522120-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015123737-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7535354-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7378780-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008236782-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9412676-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010207697-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008012451-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9503099-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010013565-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7932786-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2219291-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2219291-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007001555-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9287882-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8373266-B2 |
| priorityDate |
2002-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |