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filingDate 2003-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83dec0f1f2c9b835246d704ff46cb4c1
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publicationDate 2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004040656-A1
titleOfInvention Method and apparatus for CMP retaining ring
abstract A two piece, metal and plastic, retaining ring used for chemical mechanical polishing of semiconductor substrates. In one embodiment, the plastic is selected from polyphenylene sulfide (PPS), polyethylene terephthalate, polyetheretherketone, polybutylene terephthalate, Ertalyte TX, PEEK, Torlon, Delrin, PET, Vespel, or Duratrol, and the plastic is assembled to a stainless steel ring with a urethane adhesive at room temperature. In another embodiment, the plastic is assembled to the metal portion with an acrylic adhesive at room temperature.
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