| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-24 |
| filingDate |
2002-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd2bbea3e2b7de11d523f2231dd50cee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fd2416be7d1786e17ba5309531d70d4 |
| publicationDate |
2004-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004014255-A1 |
| titleOfInvention |
Thick solder mask for confining encapsulant material over selected locations of a substrate, assemblies including the solder mask, and methods |
| abstract |
A solder mask includes an opening through which intermediate conductive elements may be positioned between bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured and corresponding contact areas of the carrier substrate. An assembly is formed by forming the solder mask on or securing the solder mask on the carrier substrate. The semiconductor die is then attached to the carrier substrate such that bond pads of the semiconductor die are exposed through the aligned openings in the substrate and solder mask. Intermediate conductive elements are then used to electrically connect the bond pads to corresponding contact areas on the substrate. An encapsulant material is introduced into an area defined by the solder mask and carrier substrate openings such that the intermediate conductive elements and semiconductor die surface within the aligned openings are encapsulated. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005042856-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006205117-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005156331-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8883562-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005156314-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007096285-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006270118-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005014323-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100428454-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008083976-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006189005-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8680662-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8431435-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7589010-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005253261-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011049696-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8241959-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8426957-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8349654-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016081199-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005208704-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7125748-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8513794-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110911294-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8513789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7041532-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005173790-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8129839-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006003569-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8999810-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7095106-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7084012-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005282313-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7087984-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8466542-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8076788-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8461673-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8461672-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005269714-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7170171-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006017175-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9378967-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011230013-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9048234-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7166925-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8551815-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7368391-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9899353-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8476774-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010270679-A1 |
| priorityDate |
2002-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |