| abstract |
A method for manufacturing a smart label web comprises smart labels placed one after and/or next to each other and comprising a circuitry pattern and an intergrated circuit on a chip therein. In the method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web. The integrated circuit on the chip is attached to the circuitry of the smart label by means of a thermoplastic film on the surface of the chip. |