Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate |
2002-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_619dade493d6e72d7bf874ff6bf2265c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d3729ea569034352bc584e7e6e4b3f5 |
publicationDate |
2004-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2004000426-A1 |
titleOfInvention |
Process for creating holes in polymeric substrates |
abstract |
Provided is a process for creating a via through a substrate including the steps of (a) providing a substantially void-free film of a curable composition; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas of the curable film to form holes through the curable film; and (f) heating the curable film of step (e) to a temperature and for a time sufficient to cure the curable composition. Also disclosed is a process of fabricating a circuit assembly which includes building patterned circuit layers upon a substrate that has vias provided by the aformentioned process. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006275987-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102835194-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9269686-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9461010-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7700269-B2 |
priorityDate |
2002-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |