| abstract |
A room-temperature curable organopolysiloxane composition comprising a straight chain organopolysiloxane with hydroxyl groups and/or alkoxy groups at the terminals of the molecular chain, a ferrite such as a Ni—Zn-based ferrite, and a silane compound with hydrolysable groups such as alkenoxy groups, ketoxime groups or alkoxy groups, and/or a partial hydrolysis-condensation product thereof, produces a silicone rubber which displays excellent adhesion to substrates formed from synthetic resins such as acrylic resins, polyamide resins, polybutylene terephthalate, polystyrene and polyphenylene sulfide. The composition is useful as a sealing material, or as an adhesive for electrical components or electronic components. |