| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd83260a96356882b5f50dd097411a72 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2003-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b6e1a576559f202b872a5e340b8f3d2 |
| publicationDate |
2003-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003201536-A1 |
| titleOfInvention |
Semiconductor device and manufacturing process therefor as well as plating solution |
| abstract |
An object of this invention is to improve stress-migration resistance and reliability in a semiconductor device comprising a metal region. In an insulating film 101 is formed a lower interconnection consisting of a barrier metal film 102 and a copper-silver alloy film 103, on which is then formed an interlayer insulating film 104. In the interlayer insulating film 104 is formed an upper interconnection consisting of a barrier metal film 106 and a copper-silver alloy film 111. The lower and the upper interconnections are made of a copper-silver alloy which contains silver to an amount more than a solid solution limit of silver to copper. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006019496-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7205667-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006012046-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005070090-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015382460-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007161242-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008042281-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006128148-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7335596-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010052171-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006270228-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7312164-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7871924-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007170551-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005164500-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005153548-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11248305-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7238617-B2 |
| priorityDate |
2002-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |