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filingDate 2003-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003196599-A1
titleOfInvention Apparatus for clamping a planar substrate
abstract The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising: n a. an electrostatic chuck having a collection surface with at least one grain collection zone for, when the planar substrate is layered on the collection surface, electrostatically directing charged grains to a corresponding surface on the planar substrate; and n b. a pattern of holes through the electrostatic chuck allowing a source of low pressure to act through the electrostatic chuck to adhere the planar substrate.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006011594-A1
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