| abstract |
A high viscosity, cured silicone-based thermal interface material is disclosed. The thermal interface material adapts readily to conform to heat transfer surfaces. For example, the thermal interface material is placed between a heat source, such as a central processing unit (CPU) of a computer, and a heat sink attached to the CPU. In use, the thermal interface material absorbs the heat from the CPU and transfers the heat to the heat sink, thereby cooling the CPU. The material has high rates of heat transfer, as measured by low thermal resistance and high thermal conductivity. |