http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003170424-A1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-977
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
filingDate 2003-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec53afb62f8901912ceacfe422f38e21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b6a43cbb78ab6e621f95b1a01c3c51a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3983f55c8f6662c71fac22951cbe553e
publicationDate 2003-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003170424-A1
titleOfInvention Method for bonding and debonding films using a high-temperature polymer
abstract The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9472437-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8764026-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011010908-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011014774-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10580678-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9837295-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9859141-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8267143-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010263794-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010266373-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9064686-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9583374-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8919412-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8181688-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9281229-B2
priorityDate 2001-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5413874-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5406124-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6136171-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6486008-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6280794-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6323108-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002163062-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129973466
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10403
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127752709
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128945327
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID75966
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127458412
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7674
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10400
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127623963
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128943684
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11194
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127513473
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8452
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128173737
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8114
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8133

Total number of triples: 52.