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filingDate 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003166304-A1
titleOfInvention Method of forming a ferroelectric film and fabrication process of a semiconductor device having a ferroelectric film
abstract A method of forming a ferroelectric film includes the steps of forming a layer by a material that takes a metal state in a reducing ambient and an oxide state in an oxidizing ambient, and depositing a ferroelectric film on a surface of the layer by supplying gaseous sources of the ferroelectric film and an oxidizing gas and causing a decomposition of the gaseous sources at the surface of said layer, wherein the step of depositing the ferroelectric film is started with a preparation step in which the state of the surface of said layer is controlled substantially to a critical point in which the layer changes from the metal state to the oxide state and from the oxide state to the metal state.
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