| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 |
| filingDate |
2002-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d45bb5ca5f2acce007907a10791ffbf7 |
| publicationDate |
2003-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003160310-A1 |
| titleOfInvention |
Micro-machined semiconductor package |
| abstract |
A hermetic multi-layered ceramic semiconductor package for micro-machined semiconductor devices. The package has a substrate with top and bottom surfaces. A micro-machined semiconductor device is located adjacent to the top surface. Vias extend through the substrate between the surfaces. The micro-machined semiconductor device is electrically connected to the vias. A rigid support is located between the micro-machined semiconductor device and the top surface to support the micro-machined semiconductor device during assembly and to space the micro-machined semiconductor device from the top surface. Solder spheres are mounted to the bottom surface and are connected to the vias. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023005881-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009212407-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006057830-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009127639-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005003578-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111137839-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7011987-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102020128095-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7897503-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7449405-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006182939-A1 |
| priorityDate |
2002-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |