Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
filingDate |
2002-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e8d11462d8455cb29d3d32cf4bea0aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6c8af715504a556e9cac5b528095a15 |
publicationDate |
2003-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2003155248-A1 |
titleOfInvention |
Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings |
abstract |
An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications. The process includes steps of depositing a radially-layered dendritic copolymer on selected surfaces of a dielectric substrate; cross-linking the radially-layered dendritic copolymer to form a dendritic polymer network; sorbing metal cations into the cross-linked dendritic polymer network; reducing the metal cations to form a nanocomposite composition exhibiting adequate surface electrical conductivity for electroplating; and electroplating a metal onto the nanocomposite composition to form an electrically conductive deposit. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019044651-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019077920-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11013125-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019044651-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019008051-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3428313-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012123574-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113507793-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11624120-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I754095-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11310918-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7157749-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004081762-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103476966-A |
priorityDate |
2002-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |