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filingDate 2002-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ecac8a5e2609f4ae4f7dd6bc4d9c5a3
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publicationDate 2003-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003153100-A1
titleOfInvention Process for producing PZT films by chemical vapor deposition method
abstract This invention provides a process for producing PZT films by specifying a Ti material having a broad allowable temperature range for giving a predetermined film composition, easily thermally deposited from Ti(OiPr) 2 (dpm) 2 even at a low substrate temperature of 450° C. or less in CVD where starting materials are fed in a solution vaporization system. Ti(OiPr) 2 (dibm) 2 is used as a Ti source, and a solution of a combination of Pb(dpm) 2 -Zr(OiPr)(dpm) 3 -Ti(OiPr) 2 (dibm) 2 in n-butyl acetate is vaporized and supplied at 200 ° C., and subjected to CVD at a substrate temperature of 420° C. at 1 Torr in an oxygen atmosphere, whereby excellent PZT films can be produced. n Ti(OiPr) 2 (dibm) 2 has a melting point of 105° C., a high solubility and a vapor pressure of 1 Torr/150° C. and does not react with Pb(dpm) 2 , and a solution thereof in n-butyl acetate has a pot life of 3 months.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004106583-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007287248-A1
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 52.