| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fc8bbba7dbfdc1fe42f350fc84e17a3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate |
2003-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7f0f8ee6f9b4d7a8edfbdd1597246bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d3479a1f008f397e5c716f6a59d8257 |
| publicationDate |
2003-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003150353-A1 |
| titleOfInvention |
Electroless gold plating solution |
| abstract |
An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 μg/cm 2 , and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10395853-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006055021-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7755183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022186378-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11702752-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11674228-B2 |
| priorityDate |
2002-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |