| abstract |
A method of separating a thin die ( 20, 60 ) from a support body ( 72 ) of a semiconductor wafer ( 70 ). The thin die ( 20, 60 ) being initially attached to the support body ( 72 ) by an attachment mechanism ( 78, 178 ). The attachment mechanism may be a plurality of tethers ( 78, 178 ) that extend between the thin die ( 20, 60 ) and the support body ( 72 ). The method may include the steps of: positioning the wafer ( 70 ) on a rigid backing ( 110 ) having a hole ( 112 ), the hole ( 112 ) positioned beneath the thin die ( 20, 60 ); positioning a tip ( 128 ) of a handler ( 120 ) above the thin die ( 20, 60 ), the tip ( 128 ) having a passageway ( 146 ) to a vacuum source; positioning an ejection pin ( 150 ) in a spaced apart relationship beneath the thin die ( 20, 60 ); moving the tip ( 128 ) of the handler ( 120 ) downward toward the thin die ( 20, 60 ) to break the attachment mechanism ( 78, 178 ) and clamp the thin die ( 20, 60 ) between the tip ( 128 ) of the handler ( 120 ) and the ejection pin ( 150 ); and moving the ejection pin ( 150 ) upward in the direction of the tip ( 128 ) of the handler ( 120 ) until the thin die ( 20, 60 ) is extracted from the wafer ( 70 ). |