| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C1-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-013 |
| filingDate |
2002-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c3588afa3bb36973641de543d47d893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_581b3bf6b01cd3b82f51411e5336691e |
| publicationDate |
2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003124855-A1 |
| titleOfInvention |
Method of improving chemical mechanical polish endpoint signals by use of chemical additives |
| abstract |
A method for buffering a chemical mechanical polish chemical slurry is disclosed. Buffering the slurry reduces buildup of local acidic areas at the interface between the polished metal and the polishing pad. Reduction of the local acidic areas improves the uniformity of the polish and an endpoint signal used to determine when to finish the polish operation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6967166-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006096702-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003194866-A1 |
| priorityDate |
2002-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |