| abstract |
A photo-curable resin composition comprising (A) an organosiloxane-bearing polymer comprising recurring units of formula (1): n n n wherein R 1 to R 4 are monovalent C 1 -C 8 hydrocarbon, n is an integer of 1-1,000, and X is n n n and having a Mw of 500-200,000, (B) a formalin-modified or formalin-alcohol-modified amino condensate, a phenol compound having on the average at least two methylol or alkoxymethylol radicals, or an epoxy compound having on the average at least two epoxy radicals, (C) a photoacid generator, and (D) a silicon compound of the formula: (R 11 ) m Si(OR 12 ) 4−m wherein R 11 is monovalent C 1 -C 9 hydrocarbon, R 12 is C 1 -C 4 alkyl, m is 0-2, forms cured pattern films having dry etch resistance and improved adhesion to substrates. |