| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c44ff52572c3406fabd4e4327af7041 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2002-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80155f1e21b0a561b0c95799304c508a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048df65291704992a454e7f7e83ade48 |
| publicationDate |
2003-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003098766-A1 |
| titleOfInvention |
Process for fabricating an electronic component incorporating an inductive microcomponent |
| abstract |
The invention relates to a process for fabricating electronic components incorporating an inductive microcomponent placed on top of a substrate. n Such a component comprises: n a layer ( 10 ) of material having a low relative permittivity, lying on the top face of the substrate ( 1 ); n a number of metal turns ( 30 - 31 ) defined on top of the layer ( 10 ) of material having a low relative permittivity; and n a copper-diffusion barrier layer ( 15 ) interposed between the metal turns ( 30 - 31 ) and the layer of material having a low relative permittivity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010008673-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010008673-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004225645-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014091477-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102496616-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005110142-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9330989-B2 |
| priorityDate |
2001-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |